半導體中心-英文

🏭 Brand / Model
Oxford / PlasmaPro 100 Cobra

⚙️ Equipment Purpose / Key Features
The inductively coupled plasma (ICP) etching system utilizes high-energy plasma technology to achieve high selectivity, precision, and uniform etching. It is suitable for silicon and III–V compound semiconductor materials and supports low-temperature processes down to –150 °C as well as atomic layer etching (ALE) technology. This system meets diverse research needs in advanced nanostructures, high aspect ratio etching, and heterogeneous material integration.

📊 Technical Specifications

• ICP Plasma Source Power: up to 3000 W (2 MHz)
• RF Power on Lower Electrode: up to 300 W (13.56 MHz)
• Process Gases: BCl₃、Cl₂、H₂、N₂、Ar、SF₆、O₂、CH₄、CHF₃
• Process Temperature: –150 °C to 400 °C
• Maximum Substrate Size: Samples with 8-inch diameter
• Equipment Features: Capable of performing ALE processes, primarily used for nanometer-scale etching of silicon-based materials and thin films

🔬 Applications

• The standard processes currently established on the system are primarily focused on silicon etching. Existing capabilities include Si Atomic Layer Etching (Si ALE) and Cryogenic Silicon Etching technologies, which enable high-precision nanoscale silicon pattern transfer and etching applications.
• Future process development will focus on expanding etching capabilities for III-V and compound semiconductor materials, including GaAs/AlGaAs and InP. These developments will target applications in optical communication and data communication devices, supporting advanced device fabrication and technology innovation.

📍 Location
Etching Area, Cleanroom, 2F, Excellence Research Building, Shuiyuan Campus, National Taiwan University

📞 Contact / Reservation
Manager: Dr. Chia-Yang Tsai
Reservation: Please book through the “Chip Driven – Taiwan Semiconductor Resource Sharing Platform.”

⚠️ Safety and Usage Notes

• Users must complete instrument training and obtain authorization before operation.
• Follow all center safety regulations and standard operating procedures (SOPs).
• Stop operation immediately and notify the manager if any abnormal condition occurs.
• Unauthorized metals are strictly prohibited from entering the chamber.
• Refer to the Operation Manual for detailed procedures.