半導體中心-英文

🏭 Brand / Model
AdNaNotek / JEB-3

⚙️ Equipment Function / Features
The ultra-high-vacuum electron beam evaporation system adopts a linear multi-chamber design (load-lock chamber + deposition chamber + oxidation chamber). It supports metal film deposition, ion beam etching, and oxidation processes. With its high-vacuum transfer system enabling continuous processing, it provides highly directional and precise deposition for nanoscale structures—ideal for high-density integrated circuits and quantum device fabrication.

📊 Technical Specifications

• Base pressure: up to 10⁻⁹ torr
• Crucible capacity: 25 c.c. × 4
• Maximum substrate size: Samples up to 8-inch diameter
• Sample loading: Load-lock system
• Substrate holder: Flat stage with tilt control (±75°) and water-cooling function
• Additional features:
  1. Real-time film thickness monitoring and automatic control
  2. Ion beam etching/cleaning
  3. Static/dynamic oxidation process capability

🔬 Applications

• Josephson junction fabrication: Designed specifically as a “three-chamber Josephson junction system.”
• Quantum devices / superconducting circuits: Ideal for processes requiring ultra-clean interfaces and low-impurity thin films.
• High-precision e-beam evaporation processes: Suitable for metal contact layers, masking layers, and specialized thin film deposition.
• Micro/nanostructure fabrication: Beneficial for MEMS, quantum dots, and miniaturized sensors requiring high-vacuum integrated processing.

📍 Location
PVD Area, Cleanroom (2F), Excellence Research Building, Shuiyuan Campus, National Taiwan University

📞 Administrator / Reservation Method
Administrator: Dr. Chih-Hao Chiang
Reservation: Please make a reservation through the “Chip Driven – Taiwan Semiconductor Resource Sharing Platform.”

⚠️ Safety and Operation Guidelines

• Users must complete equipment training and obtain operation authorization before use.
• Follow all cleanroom safety regulations and standard operating procedures (SOP).
• Stop operation immediately and notify the administrator if any abnormal conditions occur.
• This system supports metal material deposition only.
• User-supplied targets are not permitted; please confirm the currently installed targets before making a reservation (targets are replaced periodically).
• The tilt stage function is limited to samples 4 inches or smaller.
• Refer to the Operation Manual for detailed procedures.