Skip to main content

半導體中心-英文

UHV Sputter

🏭 Brand / Model
AdNaNotek / Sputter-24

 

Equipment Function / Features
This system is designed primarily for oxide thin film deposition and prohibits metal deposition to enhance process stability, prevent cross-contamination, and ensure film quality and material purity. It is particularly suitable for multilayer oxide structures and nanodevice process development.

 

📊 Technical Specifications

  • Power supplies:
    1. 1 kW RF × 2
    2. 3 kW Pulsed DC × 1
    3. 5 kW HiPIMS × 1
  • Base pressure: up to 10⁻⁸ torr
  • Substrate heating temperature: up to 600 °C
  • Sample loading: Load-lock system
  • Maximum substrate size: Samples up to 8-inch diameter
  • Additional features:
    1. Equipped with an ion source for ion-assisted deposition and pre-clean treatment
    2. Adjustable target-to-substrate distance design

 

🔬 Applications

  • Semiconductor and thin-film device fabrication: oxide thin film deposition
  • Magnetic materials and spintronics research: e.g., superconducting junctions, magnetic tunnel junctions
  • Quantum device research: systems requiring ultra-high vacuum and low-impurity films
  • Optoelectronic and sensor thin film fabrication: applications requiring high-quality films with excellent conformity and control
  • Micro/nanostructured material development: research platforms requiring precise control of film thickness, composition, and substrate processing conditions

 

📍 Location
PVD Area, Cleanroom (2F), Excellence Research Building, Shuiyuan Campus, National Taiwan University

📞 Administrator / Reservation Method
Administrator: Dr. Chih-Hao Chiang
Reservation: Please make a reservation through the “Chip Driven – Taiwan Semiconductor Resource Sharing Platform.”

 

Safety and Operation Guidelines

  • Users must complete equipment training and obtain operation authorization before use
  • Follow all cleanroom safety regulations and standard operating procedures (SOP)
  • Stop operation immediately and notify the administrator if any abnormal conditions occur
  • This system is limited to oxide material deposition only
  • User-supplied targets are not permitted; please confirm the currently installed targets before reservation (targets are replaced periodically)
  • Refer to the Operation Manual for detailed procedures