🏭 Brand / Model
JEOL / JBX-8100FS
⚙️ Equipment Function / Features
The Electron Beam Lithography (EBL) System provides ultra-high-resolution and highly tunable precision lithography capabilities. Utilizing advanced electron beam exposure, it enables the fabrication of nanostructures for high-precision semiconductor integrated circuits. The system offers exceptional stitching and overlay alignment accuracy, supported by the BEAMER proximity effect correction software, allowing precise and consistent nanostructure fabrication that meets the demanding requirements of advanced semiconductor processes and cutting-edge research.
📊 Technical Specifications
· Electron gun: ZrO/W Thermal Field Emitter
· Minimum linewidth: 8 nm
· Minimum beam diameter: Φ1.8 nm
· Acceleration voltage: 100 kV
· Beam current range: 0.1 nA – 200 nA
· Scan speed: up to 125 MHz
· Exposure field size:
1. High-resolution mode: 100 μm × 100 μm
2. High-throughput mode: 1,000 μm × 1,000 μm
· Maximum exposure area: 150 mm × 150 mm
· Overlay accuracy:
1. High-resolution mode: ±9 nm
2. High-throughput mode: ±20 nm
· Stitching accuracy:
1. High-resolution mode: ±9 nm
2. High-throughput mode: ±20 nm
· Maximum substrate size: Samples up to 8-inch diameter
·
🔬 Applications
· Micro/nano structure research and development (e.g., nanowires, nanopores, quantum devices, MEMS/NEMS structures)
· Sensor, RF, and communication component fabrication; specialized small-size chips or light sources
· Mask or micro-mask fabrication via direct writing or rapid pattern transfer
· Semiconductor research institutes or low-volume production lines requiring high-precision and flexible processes
📍 Location
Cleanroom (Advanced Lithography Area), 2F, Excellence Research Building, Shuiyuan Campus, National Taiwan University
📞 Administrator / Reservation Method
Administrator: Dr. Chia-Yang Tsai
Reservation: Please make a reservation through the “Chip Driven – Taiwan Semiconductor Resource Sharing Platform.”
⚠️ Safety and Operation Guidelines
· Users must complete equipment training and obtain operation authorization before use
· Follow all cleanroom safety regulations and standard operating procedures (SOP)
· Stop operation immediately and notify the administrator if any abnormal conditions occur
· Volatile or magnetic materials are strictly prohibited inside the chamber
· Refer to the Operation Manual for detailed procedures