Ting-Pu Tai currently is Director of Test Methodology Development Department at TSMC Advanced Package Technology Service, where he oversees the development of cutting-edge test solutions and services.

Tai has over two decades of experience in the EDA industry, having worked with renowned companies like Mentor Graphics (Siemens EDA) and Synopsys. Tai's expertise in DFT (Design for Test) product development is comprehensive. He has managed the Test Solutions Group and Test Application Group in Asia Pacific, where he provided test solutions and services across various industry segments such as autonomous transportation, mission-critical AI, high-performance computing, and mobile networking. Tai's contributions to the industry have been recognized, and he was invited to participate in the SEMI Testing Committee as a Core Team member. Tai has more than 20 IEEE publications to his credit. One of the unique aspects of Tai's experience is that he has worked with both fab and fabless for manufacturing test, in-system test, silicon debug, and yield ramping. This has given him a chance to conduct some best practices in the ecosystem. Prior to his work in EDA, Tai worked for various fabless companies such as ALI, Philips semiconductor, Holtek, etc., as an ASIC designer for microcontroller and multimedia chipset.