
Speaker’s Biography
Principal Engineer, Foundry Technology & Engineering (FTE), works on test and post silicon for Intel projects manufactured by external foundries, a part of IDM 2.0 of Intel. He was with Silicon Photonics Product Division (SPPD) between 2014 and 2021, responsible for all software development, test automation, and database solutions. He led teams ramped up 3 ODMs in Asia for max-production of multiple optical transceivers. Before joining SPPD, he was with Design Technology and Solutions Division and involved in developing various deep sub-micron noise testing solutions for Microprocessors and SOC. He was part of a team developing a full software suite for test program offline validation, enabled virtual device under test offline simulation for SOC and CPU, and tester runtime library for in-house testers. He has authored or co-authored 25+ papers in peer reviewed internal and international conferences. He was a SRC mentor and served as a technical program committee member for ATS from 2013 to 2015, 2021-2023 and ICCD from 2014 to 2017.
Abstract of Presentation
Silicon photonics represents a groundbreaking approach to data processing and transmission by seamlessly integrating optical components with electronic circuits on a single silicon chip. Silicon photonics, with its promise of high-speed data transmission and low power consumption, has been adopted by data centers ubiquitously for many years. As AI applications proliferate, data centers require faster and more efficient data processing capabilities, driving the need for higher bandwidth and lower latency communication solutions, which further drive the demand of optical transceivers. This overview delves into the fundamental principles of silicon photonics and the challenges it poses for testing. It explores various testing techniques encompassing optical, electrical, and thermal characterization methods. It underscores the necessity for rigorous testing to guarantee functionality in real-world applications. Finally, it discusses future directions and challenges in transceiver testing, highlighting the integration of ML/AI for automation, optical alignment, and the scalability of testing procedures to meet evolving standards.